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Monday, May 4, 2009

Startup Plans To Shrink Devices With Thin Chips

Start up, Vertical Circuits, has developed a technique for packing large amounts of flash memory into a tight space by using a patented ooze that creates electrical connections between chips. The company dribbles a silver-based epoxy over their chips, reducing the need for wires or bulky packages that group chips together. “The thing that has stunned me is how much a Dell or Apple will pay for thinness,” says Bill Watkins, former chief executive of Seagate and current Vertical Circuits board member. “There’s a big difference for them between 2mm and 1mm on some of this stuff.” Expect to see the technology being used in many handheld devices over the coming months.

Source: NYTime Bits Blog

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