Startup Plans To Shrink Devices With Thin Chips

Start up, Vertical Circuits, has developed a technique for packing large amounts of flash memory into a tight space by using a patented ooze that creates electrical connections between chips. The company dribbles a silver-based epoxy over their chips, reducing the need for wires or bulky packages that group chips together. “The thing that has stunned me is how much a Dell or Apple will pay for thinness,” says Bill Watkins, former chief executive of Seagate and current Vertical Circuits board member. “There’s a big difference for them between 2mm and 1mm on some of this stuff.” Expect to see the technology being used in many handheld devices over the coming months.

Source: NYTime Bits Blog

Microsoft Surface Unveiled

Microsoft has apparently announced it's latest device, the 30" touch screen / coffee table sized / 150 pound Surface PC. I saw a video of an early prototype of this technology a year or so ago but it is now set to be released to the public. As I've stated before I'm an early adopter but, at between $5,000 and $10,000 us dollars, I don't think I'll be the first guy on my street to own one. The technology is very slick and intuitive, I particularly like the T-mobile application that is demoed. Check out the YouTube video!